Thick film technology and chip joining / (by) Lewis F. Miller.
Saved in:
| Main Author: | |
|---|---|
| Format: | Book |
| Language: | English |
| Published: |
New York ; London :
Gordon and Breach,
1972
|
| Series: | Processes and materials in electronics ;
vol.1 |
| Subjects: | |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| LEADER | 00667nxm-a2200181zn-4500 | ||
|---|---|---|---|
| 001 | 000227061 | ||
| 005 | 20180201103532.0 | ||
| 008 | 940223s1972----uk-a---------00-----eng-- | ||
| 020 | |a 0677034407 | ||
| 089 | |a 621.3817 | ||
| 100 | 1 | |a Miller, Lewis F | |
| 245 | 1 | 0 | |a Thick film technology and chip joining / |c (by) Lewis F. Miller. |
| 260 | |a New York ; |a London : |b Gordon and Breach, |c 1972 | ||
| 490 | 0 | |a Processes and materials in electronics ; |v vol.1 | |
| 504 | |a Index | ||
| 650 | 0 | 0 | |a Microelectronics |
| 952 | |0 0 |1 0 |4 0 |6 621_381700000000000_MIL |7 0 |9 294990 |a PILKINGTON |b PILKINGTON |c MAIN |d 1994-02-23 |l 7 |o 621.3817/MIL |p 006335301 |r 2004-02-18 |w 2018-02-01 |y LONG | ||
| 999 | |c 193117 |d 193117 | ||