Thick film technology and chip joining / (by) Lewis F. Miller.
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| Main Author: | |
|---|---|
| Format: | Book |
| Language: | English |
| Published: |
New York ; London :
Gordon and Breach,
1972
|
| Series: | Processes and materials in electronics ;
vol.1 |
| Subjects: | |
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Pilkington Library - Pilkington Main Collection
| Shelfmark: |
621.3817/MIL |
|---|---|
| Copy [006335301] | Available |