An analytical investigation of seal ring solder voiding on IC packages

Seal ring voiding on solder sealed IC packages is discussed. Surface analysis data demonstrates that nickel oxide, which diffuses from an underlying nickel layer during high temperature processing, is a major cause of the seal ring solder voiding. Voids result from nonwelting of the solder to the go...

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Bibliographic Details
Published in:Applied surface science 1992, Vol.62 (3), p.157-165
Main Authors: Wade, W.R., Linn, J.H.
Format: Article
Language:English
Subjects:
Chemistry
Chemistry, Physical
Materials Science
Materials Science, Coatings & Films
Physical Sciences
Physics
Physics, Applied
Physics, Condensed Matter
Science & Technology
Technology
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Description
Summary:Seal ring voiding on solder sealed IC packages is discussed. Surface analysis data demonstrates that nickel oxide, which diffuses from an underlying nickel layer during high temperature processing, is a major cause of the seal ring solder voiding. Voids result from nonwelting of the solder to the gold plate due to the interference of the nickel oxide. A diffusion model is combined with kinetic data to predict nickel diffusion times as a function of gold plating thickness and processing conditions.
ISSN:0169-4332
1873-5584
DOI:10.1016/0169-4332(92)90141-J