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New copper carboxyl-ate pyrene dimers: synthesis, crystal structure, Hirshfeld surface analysis and electrochemical characterization
Two new copper dimers, namely, bis-(dimethyl sulfoxide)-tetra-kis-(μ-pyrene-1-carboxyl-ato)dicopper( - ), [Cu (C H O ) (C H OS) ] or [Cu (pyr-COO ) (DMSO) ] ( ), and bis-(di-methyl-formamide)-tetra-kis-(μ-pyrene-1-carboxyl-ato)dicopper( - ), [Cu (C H O ) (C H NO) ] or [Cu (pyr-COO ) (DMF) ] ( ) (pyr...
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Published in: | Acta crystallographica. Section E, Crystallographic communications Crystallographic communications, 2024-01, Vol.80 (Pt 1), p.1-9 |
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Main Authors: | , , , , , , , |
Format: | Article |
Language: | English |
Subjects: | |
Online Access: | Get full text |
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Summary: | Two new copper dimers, namely, bis-(dimethyl sulfoxide)-tetra-kis-(μ-pyrene-1-carboxyl-ato)dicopper(
-
), [Cu
(C
H
O
)
(C
H
OS)
] or [Cu
(pyr-COO
)
(DMSO)
] (
), and bis-(di-methyl-formamide)-tetra-kis-(μ-pyrene-1-carboxyl-ato)dicopper(
-
), [Cu
(C
H
O
)
(C
H
NO)
] or [Cu
(pyr-COO
)
(DMF)
] (
) (pyr = pyrene), were synthesized from the reaction of pyrene-1-carb-oxy-lic acid, copper(II) nitrate and tri-ethyl-amine from solvents DMSO and DMF, respectively. While
crystallized in the space group
, the crystal structure of
is in space group
2
/
. The Cu atoms have octa-hedral geometries, with four oxygen atoms from carboxyl-ate pyrene ligands occupying the equatorial positions, a solvent mol-ecule coordinating at one of the axial positions, and a Cu⋯Cu contact in the opposite position. The packing in the crystal structures exhibits π-π stacking inter-actions and short contacts through the solvent mol-ecules. The Hirshfeld surfaces and two-dimensional fingerprint plots were generated for both compounds to better understand the inter-molecular inter-actions and the contribution of heteroatoms from the solvent ligands to the crystal packing. In addition, a Cu
/Cu
quasi-reversible redox process was identified for compound
using cyclic voltammetry that accounts for a diffusion-controlled electron-donation process to the Cu dimer. |
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ISSN: | 2056-9890 2056-9890 |
DOI: | 10.1107/S2056989023010277 |