Study on the fluid/structure interaction at different inlet pressures in molded packaging

This paper presents the computational study of fluid/structure interaction (FSI) analysis in the molding process using the Mesh-based parallel Code Coupling Interface (MpCCI) method with finite volume coding (FLUENT 6.3) and finite element coding (ABAQUS 6.9). The FSI analysis is implemented on the...

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Bibliographic Details
Published in:Microelectronic engineering 2011-10, Vol.88 (10), p.3182-3194
Main Authors: Khor, C.Y., Abdullah, M.Z., Che Ani, F.
Format: Article
Language:English
Subjects:
Applied sciences
Brazing. Soldering
Coding
Deformation
Design. Technologies. Operation analysis. Testing
Electronics
Encapsulation
Exact sciences and technology
Finite element method (FEM)
Finite volume method (FVM)
Fluid flow
Fluid structure interaction (FSI)
Inlet pressure
Integrated circuits
Joining, thermal cutting: metallurgical aspects
Mathematical analysis
Metals. Metallurgy
Molded package
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Silicon
Stresses
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Summary:This paper presents the computational study of fluid/structure interaction (FSI) analysis in the molding process using the Mesh-based parallel Code Coupling Interface (MpCCI) method with finite volume coding (FLUENT 6.3) and finite element coding (ABAQUS 6.9). The FSI analysis is implemented on the molded package during the encapsulation process with different inlet pressures. Real-time flow visualization, deformation and stress of the silicon die during the encapsulation process are presented in this paper. A fluctuation phenomenon of the silicon die is found in the encapsulation process when the inlet pressure increases. The maximum deformation during the process is determined at different locations on the silicon die, calculated during the final stage of the filling process. The deformation and stress of the die is exponentially increased with increasing inlet pressure. The maximum stress on the solder bump is concentrated near to the inlet gate. Thus, the present FSI analysis approach is expected to be a guideline or reference and provides better understanding of the encapsulation process for package design in the microelectronic industry.
ISSN:0167-9317
1873-5568
DOI:10.1016/j.mee.2011.06.026