Preparation of Cu-SiO2 composite aerogel by ambient drying and the influence of synthesizing conditions on the structure of the aerogel

A copper-doped silica composite aerogel with high specific surface area was prepared using a sol-gel method at ambient pressure. A drying control chemical additive (DCCA) N,N-dimethylformamide (DMF) was introduced to the composite sol of tetraethyl orthosilicate (TEOS) and copper nitrate (Cu(NO3)2·3...

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Bibliographic Details
Published in:Chinese science bulletin 2011-03, Vol.56 (7), p.685-690
Main Authors: Li, GuiAn, Zhu, TingLiang, Deng, ZhongXun, Zhang, YaJuan, Jiao, Fei, Zheng, HaiRong
Format: Article
Language:English
Subjects:
Aerogels
CATALYSTS
chemical control
Chemistry/Food Science
COMPOSITES
Copper
COPPER NITRATE
COPPER OXIDE
DRYING
Earth Sciences
Engineering
HEAT TREATING
Heat treatment
high temperature treatment
Humanities and Social Sciences
Life Sciences
multidisciplinary
Physics
POROSITY
Science
Science (multidisciplinary)
silica
SILICON DIOXIDE
Specific surface
surface area
THERMAL STABILITY
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Summary:A copper-doped silica composite aerogel with high specific surface area was prepared using a sol-gel method at ambient pressure. A drying control chemical additive (DCCA) N,N-dimethylformamide (DMF) was introduced to the composite sol of tetraethyl orthosilicate (TEOS) and copper nitrate (Cu(NO3)2·3H2O) during the synthesizing process. The influence of the preparation conditions including Cu loading, catalyst concentration and heat treatment on the structure of copper-doped silica was investigated. The results showed that the obtained aerogel particles were uniformly distributed. The pore diameter was in a range of 2 to 15 nm. Heavier Cu loading benefited the formation of CuO crystalline, and reduced the specific surface area and pore diameter. When the catalyst concentration was high, the aggregation of Si-O network was reduced with the increase of it. The composite aerogel exhibited a good thermal stability after the heat treatment at high temperature.
ISSN:1001-6538
1861-9541
DOI:10.1007/s11434-011-4413-3