Eutectic Al–Si–Cu–Fe–Mn alloys with enhanced mechanical properties at room and elevated temperature

► Fabricated a kind of high performance Al–Si alloy with low production costs. ► Clarified two different morphologies of α-Fe and corresponding crystal structures. ► Analyzed the crystallography of Cu-rich phases before and after T6 treatment. ► Fracture mechanism of precipitates in experimental all...

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Bibliographic Details
Published in:Materials in engineering 2011-09, Vol.32 (8), p.4333-4340
Main Authors: Wang, E.R., Hui, X.D., Chen, G.L.
Format: Article
Language:English
Subjects:
A. Non-ferros metals and alloys
Alloys
ALUMINUM ALLOYS (50 TO 99 AL)
Aluminum base alloys
B. Casting
Blocking
Dendritic structure
DENDRITIC STRUCTURES
E. Mechanical
ELEVATED TEMPERATURE
Eutectic temperature
MECHANICAL PROPERTIES
MOLDS
PHASE DIAGRAMS
PHASES
PROPERTIES
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Summary:► Fabricated a kind of high performance Al–Si alloy with low production costs. ► Clarified two different morphologies of α-Fe and corresponding crystal structures. ► Analyzed the crystallography of Cu-rich phases before and after T6 treatment. ► Fracture mechanism of precipitates in experimental alloys during tensile process. In this paper, we report a novel kind of eutectic Al–Si–Cu–Fe–Mn alloy with ultimate tensile strength up to 336 MPa and 144.3 MPa at room temperature and 300 °C, respectively. This kind of alloy was prepared by metal mold casting followed by T6 treatment. The microstructure is composed of eutectic and primary Si, α-Fe, Al 2Cu and α-Al phases. Iron-rich phases, which were identified as BCC type of α-Fe (Al 15(Fe,Mn) 3Si 2), exist in blocky and dendrite forms. Tiny blocky Al 2Cu crystals disperse in α-Fe dendrites or at the grain boundaries of α-Al. During T6 treatment, Cu atoms aggregate from the super-saturation solid solution to form GP zones, θ″ or θ′. Further analysis found that the enhanced mechanical properties of the experimental alloy are mainly attributed to the formation of α-Fe and copper-rich phases.
ISSN:0261-3069
DOI:10.1016/j.matdes.2011.04.005