Multi-Chip Module Packaging For W-Band rm LiNbO 3 Modulator

This letter presents ribbon bond transition of coplanar waveguides (CPWs) between two largely different dielectric constant materials, lithium niobate ( rm LiNbO 3 ) and alumina ( rm Al 2 rm O 3 ) . The design plays an important role in multi-chip module (MCM) integrations of optoelectronic devices...

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Bibliographic Details
Published in:IEEE microwave and wireless components letters 2011-03, Vol.21 (3), p.145-147
Main Authors: Shireen, Rownak, Shi, Shouyuan, Yao, Peng, Prather, Dennis W
Format: Article
Language:English
Subjects:
Aluminum
Bonding
Devices
Lithium niobates
Modulators
Modules
Optical data processing
Optoelectronic devices
Ribbons
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Summary:This letter presents ribbon bond transition of coplanar waveguides (CPWs) between two largely different dielectric constant materials, lithium niobate ( rm LiNbO 3 ) and alumina ( rm Al 2 rm O 3 ) . The design plays an important role in multi-chip module (MCM) integrations of optoelectronic devices on rm LiNbO 3 for the applications of millimeter-wave to optical signal processing. The impacts of ribbon bond parameters and CPW dimensions on the transmission characteristics are investigated over 100 GHz bandwidth. Simulated results are confirmed by measurements of the fabricated device.
ISSN:1531-1309
1558-1764
DOI:10.1109/LMWC.2010.2103375