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Effective electrodeposition of Co–Ni–Cu alloys nanoparticles in the presence of alkyl polyglucoside surfactant
The effect of alkyl polyglucoside (APG) surfactant on the electrodeposition Co–Ni–Cu alloys nanoparticles has been investigated. In a typical electrodeposition experiment, it was found that as prepared Co–Ni–Cu alloys nanoparticles characteristics, such as size homogeneity, density, dispersion on th...
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Published in: | Applied surface science 2010-11, Vol.257 (3), p.1027-1033 |
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Main Authors: | , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | The effect of alkyl polyglucoside (APG) surfactant on the electrodeposition Co–Ni–Cu alloys nanoparticles has been investigated. In a typical electrodeposition experiment, it was found that as prepared Co–Ni–Cu alloys nanoparticles characteristics, such as size homogeneity, density, dispersion on the electrode substrate and the chemicals composition, depended strongly on the concentration of APG used in the reaction as well as the applied deposition potential. For the case of chemicals composition, low APG concentration (below CMC) was found to be effective for the preparation of excellent composition of the nanoalloys. Meanwhile, for the case of size homogeneity, density, and dispersion on the surface, high APG concentration (above CMC) and high deposition potential were preferred. It was also found that, at concentration above the CMC, the APG surfactant showed a metals ions deposition inhibition characteristic that caused increasing in the electrodeposition overpotential of the entire metals ions, namely cobalt, nickel and copper. As the result the copper was found to place a high percentage in the nanoalloys deposits. Owing to its simple procedure in controlling the composition and the nanoalloys growth characteristic, present approach should find a potential application in preparing Co–Ni–Cu magnetic nanoparticles for used in currently existing applications. |
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ISSN: | 0169-4332 1873-5584 |
DOI: | 10.1016/j.apsusc.2010.07.103 |