Packaging design challenges of the IBM System z10 Enterprise Class server

This paper describes the system packaging and technologies of the IBM System z10(TM) high-end Enterprise Class server. This machine exceeds the multiprocessor performance of the previous system by 50%. A new generation of the IBM Elastic Interface was developed in order to maintain the increased int...

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Bibliographic Details
Published in:IBM journal of research and development 2009-01, Vol.53 (1), p.1-10:12
Main Authors: Winkel, T-M, Harrer, H, Kaller, D, Supper, J, Dreps, D M, Christian, K L, Cosmadelis, D, Zhou, T, Strach, T, Ludwig, J, Edwards, D L
Format: Article
Language:English
Subjects:
Mainframes
Microprocessors
Package design
Servers
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Summary:This paper describes the system packaging and technologies of the IBM System z10(TM) high-end Enterprise Class server. This machine exceeds the multiprocessor performance of the previous system by 50%. A new generation of the IBM Elastic Interface was developed in order to maintain the increased interconnect signal speed of up to 2.93 Gb/s. Power control and power delivery to the multicore processors were a special challenge for the server packaging because of the high currents and the high number of voltage domains. [PUBLICATION ABSTRACT]
ISSN:0018-8646
0018-8646
2151-8556
DOI:10.1147/JRD.2009.5388589