Ultrasound influence on the activation step before electroless coating

This paper is devoted to the electroless plating of non-conductive substrates under ultrasound at 530 kHz. The ultrasonic irradiation is applied to the activation and to the plating steps. Effects are measured by following the final copper thickness obtained in 1 h of plating time, easily correlated...

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Bibliographic Details
Published in:Ultrasonics sonochemistry 2003-10, Vol.10 (6), p.363-368
Main Authors: Touyeras, F, Hihn, J.Y, Delalande, S, Viennet, R, Doche, M.L
Format: Article
Language:English
Subjects:
Electroless plating
Power ultrasound
Sonoelectrochemistry
XPS palladium measurements
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Summary:This paper is devoted to the electroless plating of non-conductive substrates under ultrasound at 530 kHz. The ultrasonic irradiation is applied to the activation and to the plating steps. Effects are measured by following the final copper thickness obtained in 1 h of plating time, easily correlated to the average plating rate. It appears that ultrasound has a strong influence on the plating rates enhancement, and assumptions can be made that this increase could be linked to the catalyst cleaning. This is confirmed by XPS measurements.
ISSN:1350-4177
1873-2828
DOI:10.1016/S1350-4177(03)00098-1