CO adsorption on copper in alkaline electrolytes: an electrochemical and ellipsometric study

The influence of CO on the passive behavior of copper was analyzed in the potential region near the rest potential in borax solutions (pH 9.2) by cyclic voltammetry, ellipsometry, and surface charge determination techniques. The oxide formation is explained as a sequence of Cu 2O growth, cation adso...

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Bibliographic Details
Published in:Journal of colloid and interface science 2003-08, Vol.264 (1), p.114-120
Main Authors: Torres Sánchez, R.M, Castro Luna, A.M, Zerbino, J.O
Format: Article
Language:English
Subjects:
Chemistry
Exact sciences and technology
General and physical chemistry
Solid-liquid interface
Surface physical chemistry
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Summary:The influence of CO on the passive behavior of copper was analyzed in the potential region near the rest potential in borax solutions (pH 9.2) by cyclic voltammetry, ellipsometry, and surface charge determination techniques. The oxide formation is explained as a sequence of Cu 2O growth, cation adsorption, Cu(II), and dissolution steps, similarly to previously reported investigations for the metal in free CO solutions. The CO adsorption hinders the cationic defect in the outer oxide layer and accelerates the Cu 2O growth both at open circuit and in controlled potential experiments. The isoelectric point, iep, obtained at pH 10.8 for both the metal Cu and CuO particles in KCl solutions shifts to pH 10.1 for copper particles in the presence of CO. The iep indicates a CuO coating on Cu metallic particles in the absence of CO.
ISSN:0021-9797
1095-7103
DOI:10.1016/S0021-9797(03)00334-5