Microstructural modeling of dynamic recrystallization using irregular cellular automata

Cellular automaton (CA) was used to simulate dynamic recrystallization (DRX) during thermomechanical deformation. Initial grain size, initial grain orientation and dislocation density were used as input data to the CA model. Flow curve, dislocation density, final grain size and orientation, and DRX...

Full description

Saved in:
Bibliographic Details
Published in:Computational materials science 2008-12, Vol.44 (2), p.566-576
Main Authors: Yazdipour, N., Davies, C.H.J., Hodgson, P.D.
Format: Article
Language:English
Subjects:
Cold working, work hardening
annealing, quenching, tempering, recovery, and recrystallization
textures
Cross-disciplinary physics: materials science
rheology
Dislocation density
Dynamic recrystallization
Exact sciences and technology
Irregular cellular automata
Materials science
Microstructural modeling
Physics
Thermomechanical parameters
Treatment of materials and its effects on microstructure and properties
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:Cellular automaton (CA) was used to simulate dynamic recrystallization (DRX) during thermomechanical deformation. Initial grain size, initial grain orientation and dislocation density were used as input data to the CA model. Flow curve, dislocation density, final grain size and orientation, and DRX volume fraction were the output data which were compared with experimental data to validate the model. The model proposed in this work considered the thermomechanical parameters (e.g., temperature and strain rate) and their role on the nucleation and growth kinetics during DRX. It was shown that the CA model can predict the final microstructure and flow curve to a high degree of accuracy and was able to successfully simulate the volume fraction of DRX as a function of strain for a wide range of deformation conditions.
ISSN:0927-0256
1879-0801
DOI:10.1016/j.commatsci.2008.04.027