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Effect of adhesive system on microleakage in class II direct composite restorations

This study evaluated microleakage at the dentin/composite and enamel/composite interfaces in Class II restorations using 4 different newly-developed experimental hydroxyapatite-filled adhesive systems. Ninety-six box-type Class II standardized cavities were prepared on both proximal surfaces of prev...

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Bibliographic Details
Published in:Journal of Optoelectronics and Advanced Materials 2008-04, Vol.10 (4), p.954-957
Main Authors: Nicola, M, Sava, S, Moldovaw, M, Prejmerean, C, Rominu, M, Bondor, C, Dudea, D, Zeno, F
Format: Article
Language:English
Online Access:Get full text
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Summary:This study evaluated microleakage at the dentin/composite and enamel/composite interfaces in Class II restorations using 4 different newly-developed experimental hydroxyapatite-filled adhesive systems. Ninety-six box-type Class II standardized cavities were prepared on both proximal surfaces of previously extracted sound human molars with the cervical margin located 1mm above or below the cemento-enamel junction (CEJ). Teeth were randomly assigned to 4 groups (n=12) and conditioned with one of the 4 adhesive systems. Premise nanocomposite was incrementally inserted as the final restoration. The teeth were thermocycled and immersed in 0.5% basic fuchsine solution for 24 hours. The specimens were cut into 3 slices and the resulted sections were examined using a stereomicroscope under 40x magnification. The microleakage at the enamel and cementum margins was evaluated using an ordinal scale (0-3). Data were analyzed using the KruskalWallis and Wilcoxon test at a p < 0.05 level of significance. Significantly less microleakage was associated with the use of etch & rinse adhesive systems at the enamel surface. Between the enamel and the dentin margins significantly statistical differences were found just for etch & rinse adhesives. Etch & rinse three-step adhesive containing water and ethanol as solvent performed significantly better at the dentin margins.
ISSN:1454-4164