Design and characterization of a high-precision resistor ladder test structure

A new subsite stepped multiresistor test structure is introduced. This test structure is used for studying and improving small resistance mismatch patterns in resistor ladders for high-resolution analog-to-digital converter applications. By utilizing wafer prober subsite movements and contact pad cr...

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Bibliographic Details
Published in:IEEE transactions on semiconductor manufacturing 2003-05, Vol.16 (2), p.187-193
Main Authors: Tuinhout, H.P., Hoogzaad, G., Vertregt, M., Roovers, R.L.J., Erdmann, C.
Format: Article
Language:English
Subjects:
Analog-digital conversion
Applied sciences
Circuit properties
Circuit testing
Contact
Contact resistance
Design engineering
Design. Technologies. Operation analysis. Testing
Electric, optical and optoelectronic circuits
Electrical resistance measurement
Electronic circuits
Electronics
Exact sciences and technology
Integrated circuit testing
Integrated circuits
Joints
Kelvin
Ladders
Measurement methods
Movements
Resistors
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Semiconductors
Signal convertors
Stress
Switches
System testing
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Description
Summary:A new subsite stepped multiresistor test structure is introduced. This test structure is used for studying and improving small resistance mismatch patterns in resistor ladders for high-resolution analog-to-digital converter applications. By utilizing wafer prober subsite movements and contact pad cross connections in the test structures, in combination with a Kelvin measurement method and dedicated statistical data evaluation technique, this approach enables identification of very small (
ISSN:0894-6507
1558-2345
DOI:10.1109/TSM.2003.811583