Micromachined circuits for millimeter- and sub-millimeter-wave applications

Two approaches for the development of micromachined circuits for millimeter- and submillimeter-wave applications are discussed. These technologies provide a means to overcome the drawbacks typically associated with conventional planar transmission lines, such as microstrip and coplanar waveguides. E...

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Bibliographic Details
Published in:	IEEE antennas & propagation magazine 1993-10, Vol.35 (5), p.9-17
Main Authors:	Katehi, L.P.B., Rebeiz, G.M., Weller, T.M., Drayton, R.F., Cheng, H.J., Whitaker, J.F.
Format:	Magazinearticle
Language:	eng
Subjects:	Applied sciences Circuit properties Coplanar waveguides Electric, optical and optoelectronic circuits Electronics Exact sciences and technology Micromachining Microstrip Microwave circuits, microwave integrated circuits, microwave transmission lines, submillimeter wave circuits Millimeter wave technology Packaging Planar transmission lines Planar waveguides Submillimeter wave circuits Submillimeter wave propagation Submillimeter wave technology
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Summary:	Two approaches for the development of micromachined circuits for millimeter- and submillimeter-wave applications are discussed. These technologies provide a means to overcome the drawbacks typically associated with conventional planar transmission lines, such as microstrip and coplanar waveguides. Examples demonstrating the use of micromachining to effectively incorporate a third dimension into the geometry of monolithic circuits are presented. This introduces additional parameters in the design and results in structures with superior electrical performance, such as membrane-supported circuits, and reduced volume and weight, such as micromachined-shielded circuits. Micromachined circuits which incorporate miniaturized shielding packages in a monolithic design are described. The performance of these circuits shows that the low-volume, low-weight packaging is effective in reducing signal loss, without degrading the desired frequency response.< >
ISSN:	1045-9243 1558-4143