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Interface behaviour during the self-joining of Si3N4 using a Nb-foil interlayer

This work focuses on various aspects of diffusion bonding of Nb-foil interlayer during the self joining of Si3N4. Joints were produced by hot-uniaxial pressing. The results showed that Si3N4 was solid-state bonded to Nb at temperatures ranging from 1200 to 1600 deg C. Nb5Si3 and NbSi2 were detected...

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Bibliographic Details
Published in:Scripta materialia 2006-04, Vol.54 (7), p.1339-1343
Main Authors: LEMUSRUIZ, J, LEONPATINO, C, AGUILARREYES, E
Format: Article
Language:English
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Summary:This work focuses on various aspects of diffusion bonding of Nb-foil interlayer during the self joining of Si3N4. Joints were produced by hot-uniaxial pressing. The results showed that Si3N4 was solid-state bonded to Nb at temperatures ranging from 1200 to 1600 deg C. Nb5Si3 and NbSi2 were detected at the joining interface.
ISSN:1359-6462
1872-8456
DOI:10.1016/j.scriptamat.2005.12.014