Extended TSPC structures with double input/output data throughput for gigahertz CMOS circuit design

New structures to be applied with the extended true-single-phase-clock (E-TSPC) CMOS circuit technique, an extension of the traditional true-single-phase-clock (TSPC) are presented. These structures, formed by the connection of proper data paths, allow circuits to handle data with rates that are twi...

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Bibliographic Details
Published in:IEEE transactions on very large scale integration (VLSI) systems 2002-06, Vol.10 (3), p.301-308
Main Authors: Joao Navarro, S., Van Noije, W.A.M.
Format: Article
Language:English
Subjects:
Applied sciences
Circuit design
Circuit simulation
Circuit synthesis
Circuits
Clocks
CMOS
CMOS logic circuits
CMOS process
CMOS technology
Design engineering
Design. Technologies. Operation analysis. Testing
Electric, optical and optoelectronic circuits
Electronics
Energy consumption
Exact sciences and technology
Integrated circuits
Joints
Latches
Power consumption
Prescalers
Read only memory
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Theoretical study. Circuits analysis and design
Throughput
Very large scale integration
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Summary:New structures to be applied with the extended true-single-phase-clock (E-TSPC) CMOS circuit technique, an extension of the traditional true-single-phase-clock (TSPC) are presented. These structures, formed by the connection of proper data paths, allow circuits to handle data with rates that are twice the clock rate. Examples of circuits employing such structures are shortly reported and to illustrate more complex applications, the design of a dual-modulus prescaler (divide by 128/129) in a 0.8 /spl mu/m CMOS process is fully depicted. This prescaler, according to simulations, reaches a maximum 2.19-GHz operation rate at 5 V with a 46 mW power consumption. This new approach is also compared with a previous design (implemented with the E-TSPC technique and attaining a 1.59 GHz operation rate) and with other recently published circuits.
ISSN:1063-8210
1557-9999
DOI:10.1109/TVLSI.2002.1043333