The patterning of fine-pitch electrical interconnections on non-planar substrates: a comparison between methods utilising laser ablation and electro-deposited photoresist

This paper compares and contrasts two methods that we have developed for patterning fine-pitch, electrical interconnections onto grossly non-planar surfaces. The first method involves the selective ablation of nickel using a YAG laser. The optimisation of the laser process is discussed. The second m...

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Bibliographic Details
Published in:	Sensors and actuators. A. Physical. 2004-05, Vol.112 (2-3), p.360-367
Main Authors:	Williams, G L, Wallhead, I, Sarojiniamma, V, Ivey, P A, Seed, N L
Format:	Article
Language:	eng
Online Access:	Get full text
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Summary:	This paper compares and contrasts two methods that we have developed for patterning fine-pitch, electrical interconnections onto grossly non-planar surfaces. The first method involves the selective ablation of nickel using a YAG laser. The optimisation of the laser process is discussed. The second method employs an electro-depositable photoresist (EDPR) (Shipley PEPR2400) to pattern a copper seed layer that is then overplated with nickel. The substrate studied is a piezoelectric ink-jet print head that requires up to one thousand 80 micron-pitch interconnections over a step height of 500 microns. The two technologies are found to be complementary, with laser patterning offering greater flexibility for product development and EDPR patterning offering a higher throughput for mass-production.
ISSN:	0924-4247 1873-3069