Dislocation structure in low-angle interfaces between bonded Si(001) wafers

Dislocation structures of interfaces between bonded (001) Si wafers with co-existing low-angle twist and tilt misorientations were studied by transmission electron microscopy. At dominating twist, a square screw dislocation network accommodates the twist, and interacts with steps at the interface, f...

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Bibliographic Details
Published in:Journal of materials science 2004-05, Vol.39 (9), p.3031-3039
Main Authors: AKATSU, T, SCHOLZ, R, GÖSELE, U
Format: Article
Language:English
Subjects:
Attitude (inclination)
Condensed matter: structure, mechanical and thermal properties
Configurations
Cross-disciplinary physics: materials science
rheology
Crystallography
Defects and impurities in crystals
microstructure
Direct observation of dislocations and other defects (etch pits, decoration, electron microscopy, x-ray topography, etc.)
Dislocation density
Exact sciences and technology
Joining
welding
Linear defects: dislocations, disclinations
Materials science
Materials synthesis
materials processing
Physics
Screw dislocations
Structure of solids and liquids
crystallography
Transmission electron microscopy
Wafers
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Summary:Dislocation structures of interfaces between bonded (001) Si wafers with co-existing low-angle twist and tilt misorientations were studied by transmission electron microscopy. At dominating twist, a square screw dislocation network accommodates the twist, and interacts with steps at the interface, forming 60-degree dislocations. As the step density, i.e., the tilt angle, increases relative to the twist angle, the density of so-called zigzag reactions increases. Finally, hexagonal dislocation meshes dominate the dislocation configuration. It was found that the plan-view observations give the crystallographic relations accurately. The structures of the dislocation configurations were analyzed using Bollmann's dualistic representation. The rotation axes and angles were determined.
ISSN:0022-2461
1573-4803
DOI:10.1023/B:JMSC.0000025829.40338.04