Characterisation and Optimisation of Innovative Solders for Transient Liquid Phase Bonding and Active Soldering

Hybrid microstructures, able to combine the different properties of metallic and ceramic materials, are a source of growing interest in the field of microsystem engineering. Besides the construction technique, the joining technique plays a crucial role within this framework. Two innovative bonding t...

Full description

Saved in:
Bibliographic Details
Published in:Advanced engineering materials 2004-03, Vol.6 (3), p.160-163
Main Authors: Lugscheider, E., Ferrara, S.
Format: Article
Language:English
Subjects:
Applied sciences
Exact sciences and technology
Liquid Phase Bonding
Microsystems technology
Soldering
Citations: Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:Hybrid microstructures, able to combine the different properties of metallic and ceramic materials, are a source of growing interest in the field of microsystem engineering. Besides the construction technique, the joining technique plays a crucial role within this framework. Two innovative bonding technologies have been investigated: Transient Liquid Phase (TLP) Bonding and Active Soldering. New solders have been developed, evaluated and characterized with regard to fundamental parameters for the microstructures.
ISSN:1438-1656
1527-2648
DOI:10.1002/adem.200300538