Surface Acoustic Wave Functional Devices Coupled with Film-Bonded Semiconductor Active Elements

Authors investigate a future high-speed real time analog signal processing circuit by co-integrating a semiconductor active array device with a surface acoustic wave (SAW) device in one chip. Authors propose a novel semiconductor coupled SAW functional device with a traveling wave amplifier structur...

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Bibliographic Details
Published in:Japanese Journal of Applied Physics 2002, Vol.41 (Part 1, No. 5B), p.3483-3488
Main Authors: Hohkawa, Kohji, Koh, Keishin, Aoki, Yusuke, Kanashiro, Chinami, Nam, Song Min
Format: Article
Language:English
Online Access:Get full text
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Summary:Authors investigate a future high-speed real time analog signal processing circuit by co-integrating a semiconductor active array device with a surface acoustic wave (SAW) device in one chip. Authors propose a novel semiconductor coupled SAW functional device with a traveling wave amplifier structure and show basic characteristics of the devices using a circuit simulator. Using epitaxial liftoff film bonding technology, authors fabricated a basic test device on LiNbO3 substrate and measured the basic characteristics of the functional device. 10 refs.
ISSN:0021-4922
1347-4065
DOI:10.1143/JJAP.41.3483