Fracture of Sn-3.5%Ag solder alloy under creep

Creep deformation is the most common and important type of loading a solder joint undergoes. Our previous papaer described the changes in microstructure of Sn-3.5Ag solder alloy during creep deformation. It was suggested that particles of intermetallics, dispersed in the tine matrix, play a signific...

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Bibliographic Details
Published in:Journal of electronic materials 2000-12, Vol.29 (12), p.1356-1361
Main Authors: IGOSHEV, V. I, KLEIMAN, J. I, SHANGGUAN, D, WONG, S, MICHON, U
Format: Article
Language:English
Subjects:
Applied sciences
Brazing. Soldering
Electronics
Exact sciences and technology
Joining, thermal cutting: metallurgical aspects
Materials
Metals. Metallurgy
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Summary:Creep deformation is the most common and important type of loading a solder joint undergoes. Our previous papaer described the changes in microstructure of Sn-3.5Ag solder alloy during creep deformation. It was suggested that particles of intermetallics, dispersed in the tine matrix, play a significant role in alloy failure. Experimental data on the creep and failure of the Sn-3.0% Ag, Sn-3.5% Ag, and Sn-4.0% Ag lead free solder alloys are described. Further development of the alloys' failure micromechanism, proposed earlier, is presented. Possible ways of improving the mechanical properties of Sn-Ag-based solder alloys are discussed.
ISSN:0361-5235
1543-186X
DOI:10.1007/s11664-000-0119-z