Stress relaxation behaviour in bending of high strength copper alloys in the Cu–Ni–Sn system

The microstructure of spinodally hardened, stress relaxation tested Cu–Ni–Sn alloys is characterized. The main mechanism of relaxation is recrystallization. At 150°C, initial stress values of 480–600 N mm −2 cause significant microstructural changes even if up to 90% of the initial stress remains af...

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Bibliographic Details
Published in:Materials science & engineering. A, Structural materials : properties, microstructure and processing Structural materials : properties, microstructure and processing, 1997-11, Vol.238 (2), p.407-410
Main Authors: Virtanen, P, Tiainen, T
Format: Article
Language:English
Subjects:
Anelasticity, internal friction, stress relaxation, and mechanical resonances
Applied sciences
Condensed matter: structure, mechanical and thermal properties
Constant-composition solid-solid phase transformations: polymorphic, massive, and order-disorder
Cross-disciplinary physics: materials science
rheology
Cu–Ni–Sn
Elevated temperature stability
Exact sciences and technology
High strength alloys
Materials science
Mechanical and acoustical properties of condensed matter
Metals. Metallurgy
Phase diagrams and microstructures developed by solidification and solid-solid phase transformations
Physics
Stress relaxation
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Summary:The microstructure of spinodally hardened, stress relaxation tested Cu–Ni–Sn alloys is characterized. The main mechanism of relaxation is recrystallization. At 150°C, initial stress values of 480–600 N mm −2 cause significant microstructural changes even if up to 90% of the initial stress remains after 1000 h of testing. Elevated temperature stability depends on the uniformity of deformation.
ISSN:0921-5093
1873-4936
DOI:10.1016/S0921-5093(97)00462-0