Effect of superimposed square wave alternating current during electrocrystallization of copper on copper single crystal planes

The morphology of Cu electrodeposits on Cu single crystal planes is affected by superimposing a square wave alternating current (a.c.) on a direct current (d.c.). The effects of the a.c are discussed from the morphlogical point of view and from the cathodic polarization studies. In the presence of s...

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Bibliographic Details
Published in:Indian journal of engineering and materials sciences 1995-08, Vol.2 (4), p.177-183
Main Authors: SHYAMSUNDER, K, SHESHADRI, B. S
Format: Article
Language:English
Subjects:
Applied sciences
Chemistry
Cross-disciplinary physics: materials science
rheology
Electrochemistry
Electrochemistry and electrophoresis
Electrodeposition, electroplating
Exact sciences and technology
General and physical chemistry
Materials science
Metals. Metallurgy
Methods of deposition of films and coatings
film growth and epitaxy
Miscellaneous (electroosmosis, electrophoresis, electrochromism, electrocrystallization, ...)
Physics
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Summary:The morphology of Cu electrodeposits on Cu single crystal planes is affected by superimposing a square wave alternating current (a.c.) on a direct current (d.c.). The effects of the a.c are discussed from the morphlogical point of view and from the cathodic polarization studies. In the presence of superimposed a.c. on the (111) plane, hexagonal and triangular pyramids oberved in purified acid Cu sulphate bath truncate and change to layers, then to a truncated triangular block and finally to polycrystalline type of deposit. Layer type of deposit observed on (100) plane transforms to truncated square pyramidal blocks and finally to polycrystalline deposit. On the (110) plane, ridges break up and give rise to a polycrystalline deposit. It was found that a superimposed a.c. has a depolarizing effect. The mechanism of the deposition process is discussed.
ISSN:0971-4588