Polarographic methods of monitoring addition agents in the electroplating of Sn-Pb solders

The electrochemical techniques typically used to monitor organic addition agents in electroplating baths work poorly in Sn-Pb solder plating baths. These electrochemical monitoring methods are based on the principle that additives act through their effects on the kinetics of the metal-deposition rea...

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Bibliographic Details
Published in:IBM journal of research and development 1998-09, Vol.42 (5), p.621-628
Main Author: HORKANS, J
Format: Article
Language:English
Subjects:
Acids
Additives
Applied sciences
Chemicals
Electrodes
Electronic equipment and fabrication. Passive components, printed wiring boards, connectics
Electronics
Exact sciences and technology
Microelectronic fabrication (materials and surfaces technology)
Microelectronics
Plating
Process controls
R&D
Research & development
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Voltammetry
Welding
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Summary:The electrochemical techniques typically used to monitor organic addition agents in electroplating baths work poorly in Sn-Pb solder plating baths. These electrochemical monitoring methods are based on the principle that additives act through their effects on the kinetics of the metal-deposition reaction, and thus the reaction Mn+ + ne- into M can be used as a probe to determine the additive concentration.
ISSN:0018-8646
2151-8556
0018-8646
DOI:10.1147/rd.425.0621