A method for the determination of gold thin film's mechanical properties

A method using a thin film/diffusion barrier/substrate trilayer structure approach is presented to determine the biaxial moduli and thermal expansion coefficients of gold (Au) thin films using a bending beam technique. Silicon and gallium-arsenide substrates were used. A thin layer of tungsten was d...

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Bibliographic Details
Published in:Thin solid films 1994-01, Vol.238 (1), p.70-72
Main Authors: Jou, Jwo-Huei, Liao, Chien-Neng, Jou, Ke-Wei
Format: Article
Language:English
Subjects:
Condensed matter: structure, mechanical and thermal properties
Exact sciences and technology
Mechanical and acoustical properties
Physical properties of thin films, nonelectronic
Physics
Surfaces and interfaces
thin films and whiskers (structure and nonelectronic properties)
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Summary:A method using a thin film/diffusion barrier/substrate trilayer structure approach is presented to determine the biaxial moduli and thermal expansion coefficients of gold (Au) thin films using a bending beam technique. Silicon and gallium-arsenide substrates were used. A thin layer of tungsten was deposited on the substrates as a diffusion barrier prior to the deposition of Au thin films. The measured thermal expansion coefficients of the thermally evaporated Au thin film ranges from 13.9 to 14.8 p.p.m. °C −1, while that of bulk gold is 14.2 p.p.m. °C −1. Also, the measured biaxial modulus is similar to that of bulk gold, but it obviously decreases upon annealing.
ISSN:0040-6090
1879-2731
DOI:10.1016/0040-6090(94)90650-5