An analysis of the critical conditions for diffusion-induced void formation in Ni-Cu laminate composites

An analysis that predicts, based on Kirkendall porosity formation, the critical composition difference that can exist without diffusion-induced porosity formation in laminate composites between solid-solution alloys is presented. Predictions based on laminate composites fabricated from pure nickel t...

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Bibliographic Details
Published in:Materials science & engineering. A, Structural materials : properties, microstructure and processing Structural materials : properties, microstructure and processing, 1993-08, Vol.167 (1), p.139-145
Main Authors: Wang, S.H., Matlock, D.K., Olson, D.L.
Format: Article
Language:English
Subjects:
Applied sciences
Exact sciences and technology
Metals. Metallurgy
Powder metallurgy. Composite materials
Production techniques
Technology
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Summary:An analysis that predicts, based on Kirkendall porosity formation, the critical composition difference that can exist without diffusion-induced porosity formation in laminate composites between solid-solution alloys is presented. Predictions based on laminate composites fabricated from pure nickel to nickel-copper solid-solution alloys indicate that porosity formation should be suppressed if the copper content in the solid-solution layer is below 40 at.%. The predictions are verified with metallographic observations on a series of annealed laminate composites. The implications of this study on the stability and mechanical properties of composites at high temperatures are discussed.
ISSN:0921-5093
1873-4936
DOI:10.1016/0921-5093(93)90347-H