Studies of platinum electroplating baths. I: The chemistry of a platinum tetrammine bath

The chemistry of a new commercial electroplating bath for Pt, based on a Pt(NH sub 3 ) exp 2+ sub 4 salt in a phosphate buffer, is investigated using exp 195 Pt NMR and microelectrode techniques. It is shown that the maximum rate of deposition is determined by a homogeneous chemical reaction precedi...

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Bibliographic Details
Published in:Journal of applied electrochemistry 1992-05, Vol.22 (5), p.415-420
Main Authors: LE PENVEN, R, LEVASON, W, PLETCHER, D
Format: Article
Language:English
Subjects:
Chemistry
Electrochemistry
Electrodeposition
Exact sciences and technology
General and physical chemistry
Study of interfaces
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Summary:The chemistry of a new commercial electroplating bath for Pt, based on a Pt(NH sub 3 ) exp 2+ sub 4 salt in a phosphate buffer, is investigated using exp 195 Pt NMR and microelectrode techniques. It is shown that the maximum rate of deposition is determined by a homogeneous chemical reaction preceding the electron transfer step; the nature of this homogeneous chemical reaction is discussed. A Cu plate is used as a substrate.
ISSN:0021-891X
1572-8838