A high-yield microassembly structure for three-dimensional microelectrode arrays

This paper presents a practical microassembly process for three-dimensional (3-D) microelectrode arrays for recording and stimulation in the central nervous system (CNS). Orthogonal lead transfers between the micromachined two-dimensional probes and a cortical surface platform are formed by attachin...

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Bibliographic Details
Published in:IEEE transactions on biomedical engineering 2000-03, Vol.47 (3), p.281-289
Main Authors: Qing Bai, Wise, K.D., Anderson, D.J.
Format: Article
Language:English
Subjects:
Animals
Array signal processing
Assembly
Auditory Cortex - physiology
Biological and medical sciences
Bonding
Brain
Brain - pathology
Brain - physiology
Cats
Central nervous system
CMOS integrated circuits
CMOS process
Electrodes, Implanted
Electroencephalography
Equipment Design
Functional neural stimulation
Gold
Guinea Pigs
Joining processes
Medical applications
Medical sciences
Microassembly
Microelectrodes
Microscopy, Confocal
Nervous system
Neurophysiology
Probes
Sensors
Signal processing
Signal Processing, Computer-Assisted
Silicon
Surgery (general aspects). Transplantations, organ and tissue grafts. Graft diseases
Technology. Biomaterials. Equipments
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Summary:This paper presents a practical microassembly process for three-dimensional (3-D) microelectrode arrays for recording and stimulation in the central nervous system (CNS). Orthogonal lead transfers between the micromachined two-dimensional probes and a cortical surface platform are formed by attaching gold beams on the probes to pads on the platform using wire-free ultrasonic bonding. The low-profile (150 /spl mu/m) outrigger design of the probes allows the bonding of fully assembled high-density arrays. Micromachined assembly tools allow the formation of a full 3-D probe array within 30 min. Arrays having up to 8/spl times/16 shanks on 200-/spl mu/m centers have been realized and used to record cortical single units successfully. Active 3-D probe arrays containing on-chip CMOS signal processing circuitry have also been created using the microassembly approach. In addition, a dynamic insertion technique has been explored to allow the implantation of high-density probe arrays into feline cortex at high-speed and with minimal traumatic injury.
ISSN:0018-9294
1558-2531
DOI:10.1109/10.827288