Mechanical Properties and Microstructural Characterization of Cu-4.3 Pct Sn Fabricated by Selective Laser Melting

Components were fabricated via selective laser melting (SLM) of prealloyed Cu-4.3 pct Sn powder and heat treated at 873 K and 1173 K (600 °C and 900 °C) for 1 hour. Tensile testing, conductivity measurement, and detailed microstructural characterization were carried out on samples in the as-printed...

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Bibliographic Details
Published in:Metallurgical and materials transactions. A, Physical metallurgy and materials science Physical metallurgy and materials science, 2017, Vol.48 (1), p.178-187
Main Authors: Ventura, Anthony P., Wade, C. Austin, Pawlikowski, Gregory, Bayes, Martin, Watanabe, Masashi, Misiolek, Wojciech Z.
Format: Article
Language:English
Subjects:
Characterization and Evaluation of Materials
Chemistry and Materials Science
Copper
Heat treatment
Laser beam melting
Laser sintering
Materials Science
Mechanical properties
Melting
Metallic Materials
Microstructure
Nanostructure
Nanotechnology
Physical metallurgy
Structural Materials
Surfaces and Interfaces
Thin Films
Tin
Yield strength
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Summary:Components were fabricated via selective laser melting (SLM) of prealloyed Cu-4.3 pct Sn powder and heat treated at 873 K and 1173 K (600 °C and 900 °C) for 1 hour. Tensile testing, conductivity measurement, and detailed microstructural characterization were carried out on samples in the as-printed and heat-treated conditions. Optimization of build parameters resulted in samples with around 97 pct density with a yield strength of 274 MPa, an electrical conductivity of 24.1 pct IACS, and an elongation of 5.6 pct. Heat treatment resulted in lower yield strength with significant increases in ductility due to recrystallization and a decrease in dislocation density. Tensile sample geometry and surface finish also showed a significant effect on measured yield strength but a negligible change in measured ductility. Microstructural characterization indicated that grains primarily grow epitaxially with a submicron cellular solidification substructure. Nanometer scale tin dioxide particles identified via X-ray diffraction were found throughout the structure in the tin-rich intercellular regions.
ISSN:1073-5623
1543-1940
DOI:10.1007/s11661-016-3779-x