Resistance to cold and heat stress: accumulation of phenolic compounds in tomato and watermelon plants

Tomato plants, Lycopersicon esculentum L. cv. Tmknvf 2, and watermelon plants, Citrullus lanatus [Thomb.] Mansf. cv. Dulce maravilla, were grown for 30 days at different temperatures (15, 25 and 35°C). We analysed soluble phenolics, enzymatic activities (phenylalanine ammonia-lyase, polyphenol oxida...

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Bibliographic Details
Published in:Plant science (Limerick) 2001-01, Vol.160 (2), p.315-321
Main Authors: Rivero, Rosa M, Ruiz, Juan M, Garcı́a, Pablo C, López-Lefebre, Luis R, Sánchez, Esteban, Romero, Luis
Format: Article
Language:English
Subjects:
Agronomy. Soil science and plant productions
Biological and medical sciences
Citrullus lanatus
Economic plant physiology
Fundamental and applied biological sciences. Psychology
Growth and development
Lycopersicon esculentum
Morphogenesis, differentiation, rhizogenesis, tuberization. Senescence
Phenolic compounds
Physical agents
Plant physiology and development
Vegetative apparatus, growth and morphogenesis. Senescence
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Summary:Tomato plants, Lycopersicon esculentum L. cv. Tmknvf 2, and watermelon plants, Citrullus lanatus [Thomb.] Mansf. cv. Dulce maravilla, were grown for 30 days at different temperatures (15, 25 and 35°C). We analysed soluble phenolics, enzymatic activities (phenylalanine ammonia-lyase, polyphenol oxidase and peroxidase), and dry weight. The impact of the three temperatures was different in tomato and watermelon. Our results indicate that heat stress in tomato plants occurred at 35°C, while chilling stress occurred in watermelon plants at 15°C. Thermal stress in both plants caused: (1) decreased shoot weight; (2) accumulation of soluble phenolics; (3) highest phenylalanine ammonia-lyase activity; and (4) lowest peroxidase and polyphenol oxidase activity. These results indicate that thermal stress induces the accumulation of phenolics in the plant by activating their biosynthesis as well as inhibiting their oxidation. This could be considered an acclimation mechanism of the plant against thermal stress.
ISSN:0168-9452
1873-2259
DOI:10.1016/S0168-9452(00)00395-2