Cu Nanoparticles Electrodeposited at Liquid-Liquid Interfaces: A Highly Efficient Catalyst for the Hydrogen Evolution Reaction

The electrochemical deposition of Cu nanoparticles with an average diameter of approximately 25–35 nm has been reported at liquid–liquid interfaces by using the organic‐phase electron‐donor decamethylferrocene (DMFc). The electrodeposited Cu nanoparticles display excellent catalytic activity for the...

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Bibliographic Details
Published in:Chemistry : a European journal 2015-03, Vol.21 (12), p.4585-4589
Main Authors: Aslan, Emre, Patir, Imren Hatay, Ersoz, Mustafa
Format: Article
Language:English
Subjects:
Catalysts
Catalytic activity
Chemical reactions
Chemistry
Copper
Deposition
Hydrogen evolution
liquid-liquid interface
Liquid-liquid interfaces
Nanoparticles
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Summary:The electrochemical deposition of Cu nanoparticles with an average diameter of approximately 25–35 nm has been reported at liquid–liquid interfaces by using the organic‐phase electron‐donor decamethylferrocene (DMFc). The electrodeposited Cu nanoparticles display excellent catalytic activity for the hydrogen evolution reaction (HER); this is the first reported catalytic effect of Cu nanoparticles at liquid–liquid interfaces. Chemistry at the interface: The hydrogen evolution reaction by decamethylferrocene can be efficiently catalyzed by in situ electrogenerated Cu nanoparticles at the liquid–liquid interface (see figure: DMFc=decamethylferrocene, DCE=dichloroethane).
ISSN:0947-6539
1521-3765
DOI:10.1002/chem.201406615