Material Removal Rate Control in Open-Air Type Plasma Chemical Vaporization Machining by Pulse Width Modulation of Applied Power

Plasma chemical vaporization machining (PCVM) is an ultraprecise figuring technique for optical components without introducing the subsurface damage. In our previous study, the material removal volume was controlled by changing the scanning speed of the worktable. However, because of inertia of the...

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Bibliographic Details
Published in:Key engineering materials 2014-08, Vol.625, p.593-596
Main Authors: Takeda, Yoshiki, Yamamura, Kazuya, Endo, Katsuyoshi, Hata, Yuki
Format: Article
Language:English
Subjects:
Amplitude modulation
Damage
Inertia
Machining
Material removal rate (machining)
Optical components
Pulse duration modulation
Scanning
Vaporization
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Summary:Plasma chemical vaporization machining (PCVM) is an ultraprecise figuring technique for optical components without introducing the subsurface damage. In our previous study, the material removal volume was controlled by changing the scanning speed of the worktable. However, because of inertia of the worktable, a discrepancy between the theoretical scanning speed and the actual scanning speed will occur if the spatial change rate of speed is rapid. Therefore, we proposed the application of the pulse width modulation (PWM) control and the amplitude modulation (AM) control of the applied RF power to control the material removal rate (MRR). Experimental results showed that the relationship between the MRR and the average RF power had high linearity, the control range of the PWM control mode was from 0.19 x 10-2 mm3/min to 3.90 x 10-2 mm3/min (from 5% to 100%), which was much wider than that of the AM control mode.
ISSN:1013-9826
1662-9795
1662-9795
DOI:10.4028/www.scientific.net/KEM.625.593