The SOI Micro-Accelerometer Fabricated by Sacrificial Process

This paper presents the fabricationof SOI micro-accelerometer by using the sacrificial process. The structure of the SOI micro-accelerometer is designed and analyzed by the finite element modeling. As for the fabrication issue, the problem of electrode metal layer to stand against HF etching is firs...

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Bibliographic Details
Published in:Key engineering materials 2015-05, Vol.645-646, p.616-623
Main Authors: Zhang, Zhao Yun, Su, Wei, Shi, Zhi Gui, Tang, Bin, Xiong, Zhuang, Chen, Yin Hui, Peng, Bo
Format: Article
Language:English
Subjects:
Adhesion
Electrodes
Error analysis
Error detection
Etching
Fingers
Mathematical analysis
Optimization
Releasing
Online Access:Get full text
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Summary:This paper presents the fabricationof SOI micro-accelerometer by using the sacrificial process. The structure of the SOI micro-accelerometer is designed and analyzed by the finite element modeling. As for the fabrication issue, the problem of electrode metal layer to stand against HF etching is first studied. Second, to prevent the over-etching of the BOX layer during structure releasing process, the etching rate of the BOX layer is carefully investigated and an optimal etching duration is obtained. Third, the adhesion phenomenon between comb fingers during releasing process is studied and optimized finger geometry is proposed to solve such problem. Devices based on the sacrificial process is carried out successfully, the measurement results show that the sensitivity of the accelerometer is about 35mV/g, with a maximal measurement error of 12mg, and a maximal nonlinear error of 0.41% within 50g.
ISSN:1013-9826
1662-9795
DOI:10.4028/www.scientific.net/KEM.645646.616