Opportunities and challenges of the 450mm transition

A close collaboration among IC makers, equipment and material suppliers, facility, and automation providers resulted in better alignment in the technology roadmap and lower development costs for tools and wafers. This would enable the cost-effective operation of future 450mm HVM fabs. The 450mm tran...

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Bibliographic Details
Main Authors: Lin, John, Pinyen Lin, Wen-Yu Ku, Kelling, Mark C., Akiki, Greg, Sangdong Kwon, Kwangwook Lee, Collison, Wenli, Chang, Stock, Cottle, Rand, Yu-Chih Wang, Borst, Christopher, Skilbred, David, Robertson, Frank, Farrar, Paul
Format: Conference Proceeding
Language:English
Subjects:
Companies
Consortia
Cost engineering
Devices
Equipment costs
Funding
Green products
Lithography
Meetings
Nanostructure
Plasmas
Semiconductors
Throughput
Online Access:Request full text
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Summary:A close collaboration among IC makers, equipment and material suppliers, facility, and automation providers resulted in better alignment in the technology roadmap and lower development costs for tools and wafers. This would enable the cost-effective operation of future 450mm HVM fabs. The 450mm transition will certainly create another prosperous opportunity for the semiconductor industry.
ISSN:0163-1918
2156-017X
DOI:10.1109/IEDM.2013.6724626