Synthesis and properties of soluble cross-linkable fluorinated co-polyimides

A series of high molecular weight soluble fluorinated cross-linkable co-polyimides (Co-PIs) were synthesized from 1,3-bis(2-trifluoromethyl-4-aminophenoxy)-5-(2,3,4,5-tetrafluorophenoxy)benzene (6FTFPB), 1,4-bis(4-amino-2-trifluoromethylphenoxy)benzene (6FAPB), 1,4-bis(4-amino-2-trifluoromethyl-phen...

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Bibliographic Details
Published in:Reactive & functional polymers 2014-09, Vol.82, p.58-65
Main Authors: Yao, Hongyan, Zhang, Yunhe, You, Kaiyuan, Liu, Yu, Song, Ying, Liu, Shanyou, Guan, Shaowei
Format: Article
Language:English
Subjects:
Anhydrides
Applied sciences
Crosslinking
Curing
Dielectric constant
Exact sciences and technology
Fluorinated polyimides
Fluorination
Mechanical properties
Molecular weight
Organic polymers
Physicochemistry of polymers
Polycondensation
Polymers
Preparation, kinetics, thermodynamics, mechanism and catalysts
Refractive index
Solubility
Thermal stability
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Summary:A series of high molecular weight soluble fluorinated cross-linkable co-polyimides (Co-PIs) were synthesized from 1,3-bis(2-trifluoromethyl-4-aminophenoxy)-5-(2,3,4,5-tetrafluorophenoxy)benzene (6FTFPB), 1,4-bis(4-amino-2-trifluoromethylphenoxy)benzene (6FAPB), 1,4-bis(4-amino-2-trifluoromethyl-phenoxy)-2-(3′-trifluoro-methylphenyl)benzene (m-3F-6FAPB) and 4,4′-(hexafluoroisopropylidene)diphthalic anhydride (6FDA). The weight-average molecular weights (Mws) and polydispersities of the co-polyimides were in the range 5.53–7.24 and 1.71–2.04, respectively. By adjusting the feed ratio of diamines, the refractive indices of Co-PIs films were exactly tuned in the range of 1.5203–1.5574 at 633nm. The co-polyimides showed outstanding solubility in organic solvents and high thermal stability (5% thermal weight-loss temperature beyond 525°C). Meanwhile, the films had excellent mechanical properties with high tensile strength of 100–108MPa, Young’s modulus of 3.3–4.2GPa and elongations at break of 8–15%. Polymers in the form of cast and spun films could be cross-linked by thermal curing at 260°C. After curing, the Co-PIs films showed excellent chemical resistance, high glass transition temperatures above 270°C, higher mechanical properties and thermal stability (5% thermal weight-loss temperature beyond 540°C) and low dielectric constant in the range of 2.37–2.70.
ISSN:1381-5148
DOI:10.1016/j.reactfunctpolym.2014.05.011