Synthesis and properties of cross-linkable high molecular weight fluorinated copolyimides

ABSTRACT A series of novel high molecular weight fluorinated co‐polyimides (Co‐PIs) containing styryl side chain based on 1,3‐bis(2‐trifluoromethyl‐4‐aminophenoxy)‐5‐(2,3,4,5‐tetrafluorophenoxy)benzene (6FTFPB) were successfully synthesized. The weight‐average molecular weights (Mws) and polydispers...

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Published in:Journal of polymer science. Part A, Polymer chemistry Polymer chemistry, 2014-02, Vol.52 (3), p.349-359
Main Authors: Yao, Hongyan, Zhang, Yunhe, Liu, Yu, You, Kaiyuan, Liu, Shanyou, Liu, Baijun, Guan, Shaowei
Format: Article
Language:English
Subjects:
Applied sciences
Cobalt
Crosslinking
Curing
Exact sciences and technology
Fluorination
fluoropolymers
Molecular weight
Organic polymers
Physicochemistry of polymers
polyimides
Polymers with particular properties
Preparation, kinetics, thermodynamics, mechanism and catalysts
refractive index
solubility
Solvents
Tensile properties
transparency
Wavelengths
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Summary:ABSTRACT A series of novel high molecular weight fluorinated co‐polyimides (Co‐PIs) containing styryl side chain based on 1,3‐bis(2‐trifluoromethyl‐4‐aminophenoxy)‐5‐(2,3,4,5‐tetrafluorophenoxy)benzene (6FTFPB) were successfully synthesized. The weight‐average molecular weights (Mws) and polydispersities of the co‐polyimides were in the range 8.93–10.81 × 104 and 1.33–1.82, respectively. The co‐polyimide film showed excellent solubility in organic solvents, high tensile properties (tensile strength exceeded 91 MPa), excellent optical transparency (cutoff wavelength at 332–339 nm and light transparencies above 89% at a wavelength of 550 nm), and high thermal stability (5% thermal weight‐loss temperature up to 510 °C). The casting and spinning films could be cross‐linked by thermal curing. The cured films show better combination property (including excellent resistance to solvents) than that of co‐polyimides. For instance, the glass transition temperature of Co‐PI‐1 (the molar weight ratio of 6FTFPB was 30%) increased from 217 to 271 °C, the tensile strength enhanced from 94 to 96 MPa, the 5% thermal weight‐loss temperature improved from 514 to 525 °C. Moreover, after cured, Co‐PI‐1 film also has a coefficient of thermal expansion (CTE) value of 60.3 ppm °C−1, low root mean square surface roughness (Rq) at 4.130 nm and low dielectric constant of 2.60. © 2013 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2014, 52, 349–359 Novel cross‐linkable high molecular weight fluorinated copolyimides are synthesized. The copolyimides exhibit excellent solubility, high tensile properties, and good optical transparency. The copolyimides can cross‐link thoroughly after curing at 260 °C under a vacuum. The cured copolyimides have excellent chemical resistance and high thermal properties. The obtained cured films have a low dielectric constant and excellent surface planarity.
ISSN:0887-624X
1099-0518
DOI:10.1002/pola.27007