Development of hot melt adhesive pad and its application to polishing of monocrystalline silicon

This study has developed a new polishing pad and an accompanying group of parameters for polishing monocrystalline silicon. A hot melt adhesive polishing pad coated with SiC abrasive uses these parameters more effectively and provides better polishing quality when compared with a conventional wool p...

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Bibliographic Details
Published in:Proceedings of the Institution of Mechanical Engineers. Part B, Journal of engineering manufacture Journal of engineering manufacture, 2012-01, Vol.226 (1), p.92-102
Main Authors: Tsai, S-L, Ke, H-Z, Ke, J-H, Huang, F-Y, Yan, B-H
Format: Article
Language:English
Subjects:
Adhesives
Applied sciences
Cross-disciplinary physics: materials science
rheology
Exact sciences and technology
Materials science
Mechanical engineering. Machine design
Mechanical engineers
Melts
Physics
Polished
Polishing
Precision engineering, watch making
Quality
Silicon
Surface roughness
Surface treatments
Wool
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Summary:This study has developed a new polishing pad and an accompanying group of parameters for polishing monocrystalline silicon. A hot melt adhesive polishing pad coated with SiC abrasive uses these parameters more effectively and provides better polishing quality when compared with a conventional wool pad. Three control parameters, feed rate, polishing load and turning speed of the polishing wheel, were tested to identify their impact on the polishing quality of the silicon surface. A silicon surface polished with the proposed new pad under optimum conditions can obtain surface roughness of 2.45 nm Ra with mirror-like appearance.
ISSN:0954-4054
2041-2975
DOI:10.1177/0954405410396130