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The influence of addition of nanosized molybdenum and nickel particles on creep behavior of Sn–Ag lead free solder alloy
► Sn–3.5Ag (SA) alloy & SA with nano sized Mo and Ni at three different wt.% was investigated. ► Creep behaviour was investigated using a constant load method in nanoindenter. ► Modified Garofalo’s equation demonstrated an excellent fit to indentation creep data. ► Steady state creep rate decrea...
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Published in: | Journal of alloys and compounds 2012-11, Vol.542, p.136-141 |
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Main Authors: | , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | ► Sn–3.5Ag (SA) alloy & SA with nano sized Mo and Ni at three different wt.% was investigated. ► Creep behaviour was investigated using a constant load method in nanoindenter. ► Modified Garofalo’s equation demonstrated an excellent fit to indentation creep data. ► Steady state creep rate decreased with increasing addition of Mo and Ni to base alloy. ► Primary creep stage displacement and time decreased with increasing Mo and Ni wt.%.
The effect of addition of nano-sized Ni and Mo particles on creep behavior of Sn–3.5Ag lead free solder alloy was investigated using a constant load method in a nanoindenter. Modified Garofalo’s equation was found to show an excellent fit to indentation creep data. It was observed that the steady state creep rate as well as primary creep stage displacement and primary creep stage time decreased with increasing addition of Mo and Ni to the base alloy. |
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ISSN: | 0925-8388 1873-4669 |
DOI: | 10.1016/j.jallcom.2012.07.044 |