Passive alignment optical subassemblies for military/aerospace fiber-optic transmitter/receiver modules

Under the DARPA sponsored Avionics Optoelectronic Module Technology program, new passive alignment carrier (PAC) optical subassemblies (LED-PAC and PIN-PAC) ruggedized for military/aerospace avionics fiber-optic transmitter and receiver applications have been developed, LED-PAC and PIN-PAC silicon m...

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Bibliographic Details
Published in:IEEE transactions on advanced packaging 2000-08, Vol.23 (3), p.461-469
Main Authors: Beranek, M.W., Chan, E.Y., Chiu-Chao Chen, Davido, K.W., Hager, H.E., Chi-Shain Hong, Koshinz, D.G., Rassaian, M., Soares, H.P., St. Pierre, R.L., Anthony, P.j., Cappuzzo, M.A., Gates, J.V., Gomez, L.T., Henein, G.E., Shmulovich, J., Occhionero, M.A., Fennessy, K.P.
Format: Article
Language:English
Subjects:
Aerospace electronics
Alignment
Applied sciences
Avionics
Design. Technologies. Operation analysis. Testing
Electronic equipment and fabrication. Passive components, printed wiring boards, connectics
Electronics
Exact sciences and technology
Fiber optics
Integrated circuits
Microelectronics: LSI, VLSI, ULSI
integrated circuit fabrication technology
Microorganisms
Optical fiber devices
Optical fibers
Optical films
Optical receivers
Optical refraction
Optical transmitters
Optics
Optoelectronic devices
Receivers
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Silicon
Silicon substrates
Silicon wafers
Stimulated emission
Substrates
Transmitters
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Summary:Under the DARPA sponsored Avionics Optoelectronic Module Technology program, new passive alignment carrier (PAC) optical subassemblies (LED-PAC and PIN-PAC) ruggedized for military/aerospace avionics fiber-optic transmitter and receiver applications have been developed, LED-PAC and PIN-PAC silicon micro-optical bench substrates were fabricated together on a 5 in diameter silicon wafer via multistage photolithography, thin-film, and substrate processing. Alignment v-grooves designed for passive optical alignment of 100/140 /spl mu/m multimode optical fiber to the optoelectronic devices were terminated by solder locking the fiber to the silicon PAC substrates. The LED-PAC comprising a surface emitting LED die-bonded onto a novel precision molded AM submount passively mounted onto the silicon microbench achieves the required high coupling efficiency to 100/140 /spl mu/m multimode optical fiber to meet stringent avionics transmitter output power requirements. The 100/130 /spl mu/m multimode optical fiber-pigtailed PIN-PAC with a refractive lens etched into the p-i-n photodiode backside surface exhibited responsivities greater than 0.8 A/W at 1.3 /spl mu/m wavelength. The LED-PAC and PIN-PAC optical subassemblies integrated with Boeing ARINC 636 (FDDI) transmitter and receiver thick film multichip (MCM-C) circuitry are capable of meeting both ARINC 636 and FDDI physical layer requirements.
ISSN:1521-3323
1557-9980
DOI:10.1109/6040.861561