Implementation and Experimental Evaluation of a Cryocooled System Prototype for High-Throughput SFQ Digital Applications

We report on development of a cryocooled system prototype for high-throughput single flux quantum (SFQ) digital applications. The system was designed to have 32 I/O links with a bandwidth of 10 Gbps/port. An SFQ multi-chip module (MCM), double mu-metal magnetic shields, a 40-K radiation shield, cust...

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Bibliographic Details
Published in:IEEE transactions on applied superconductivity 2007-06, Vol.17 (2), p.546-551
Main Authors: Hashimoto, Y.., Yorozu, S.., Miyazaki, T.., Kameda, Y.., Suzuki, H.., Yoshikawa, N..
Format: Article
Language:English
Subjects:
Amplifiers
Applied sciences
Bandwidth
Bit error rate
Broadband amplifiers
Circuit properties
Circuit testing
Cryocooler
Cryogenics
cryopackaging
Design. Technologies. Operation analysis. Testing
Digital
Digital circuits
Electric, optical and optoelectronic circuits
Electronic circuits
Electronics
Exact sciences and technology
Gallium arsenide
Gallium arsenides
integrated circuit
Integrated circuits
Links
Magnetic flux
Magnetic shielding
Modules
multi-chip module
Prototypes
Semiconductor device measurement
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
SFQ
superconductor
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Summary:We report on development of a cryocooled system prototype for high-throughput single flux quantum (SFQ) digital applications. The system was designed to have 32 I/O links with a bandwidth of 10 Gbps/port. An SFQ multi-chip module (MCM), double mu-metal magnetic shields, a 40-K radiation shield, customized GaAs cryogenic amplifiers, a 32-pin wide-bandwidth cryo-probe, and 32 I/O cables were packaged in a vacuum chamber together with a two-stage 4-K 1-W Gifford-McMahon (G-M) cryocooler. S-parameter measurements showed that the analog bandwidth of the I/O link was 23 GHz. We demonstrated high-speed cryocooled operation of a test module, in which a 5 mm times 5 mm SFQ circuit chip was flip-chip bonded on a 16 mm times 16 mm MCM carrier with phi30 mum InSn bump bonds, at bit rates up to 12.5 Gbps. Measured bit error rate (BER) was less than 10 -12 for a 10 23 - 1 pseudorandom bit sequence (PRBS) at 10 Gbps.
ISSN:1051-8223
1558-2515
DOI:10.1109/TASC.2007.898126