Structural and electrical properties of ZnO doped NKBN piezoelectric ceramic prepared by solid-state reaction technique for electronic application

Ceramic materials based on the composition 0.98(Na0.5K0.5NbO3) + 0.02(Sr Bi0.5Nb0.5O3) + x ZnO (x=0.0, 0.45) have been synthesized through a solid-state reaction method and characterized to explore their unique properties and potential applications. In this study, we investigated the influence of va...

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Bibliographic Details
Main Authors: Chhibber, Deeksha, Kumari, Poonam, Bala, Saroj, Kumari, Shilpa, Rai, Radheshyam
Format: Conference Proceeding
Language:English
Subjects:
Ceramics
Chemical synthesis
Crystal structure
Dielectric loss
Dielectric properties
Electrical properties
Impact analysis
Piezoelectric ceramics
Solid state
Structural analysis
Thermodynamic properties
Zinc oxide
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Summary:Ceramic materials based on the composition 0.98(Na0.5K0.5NbO3) + 0.02(Sr Bi0.5Nb0.5O3) + x ZnO (x=0.0, 0.45) have been synthesized through a solid-state reaction method and characterized to explore their unique properties and potential applications. In this study, we investigated the influence of varying " x wt% ZnO values on the physical, electrical, and structural characteristics of Na-K-Nb-O and Sr-Bi-Nb-O matrix (coded as NKBN) ceramics. Our findings show that the dielectric characteristics of the NKBN ceramics are significantly affected by the addition of ZnO to the ceramics. We noticed differences in the dielectric constant and dielectric loss depending on the ZnO doping. Additionally, the crystal structure and microstructure of the ceramics were revealed through structural analysis utilising methods including X-ray diffraction and scanning electron microscopy, which had an impact on their mechanical and thermal properties. With rising frequency and temperature, it was found that the dielectric characteristics decreased, which showed that the samples’ conductivity had increased. The change in dielectric behavior were observed and confirmed from the dielectric study of the samples for electronic application.
ISSN:0094-243X
1551-7616
DOI:10.1063/5.0225335