Correlation of structure development and electric characteristics within high pressure torsion processed copper

Abstract Copper of a high purity features excellent electric conductivity, but generally very low mechanical properties. Nevertheless, optimized deformation/thermomechanical treatment can introduce favorable combinations of both. The presented study characterizes the correlation of microstructure de...

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Bibliographic Details
Published in:Materialwissenschaft und Werkstofftechnik 2024-05, Vol.55 (5), p.579-587
Main Authors: Kocich, R., Kopeček, J., Marek, M.
Format: Article
Language:English
Subjects:
Copper
Correlation
Deformation
Electric properties
Electrical resistivity
Grain boundaries
Grain size
High pressure
Mechanical properties
Microhardness
Plastic deformation
Thermomechanical treatment
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Summary:Abstract Copper of a high purity features excellent electric conductivity, but generally very low mechanical properties. Nevertheless, optimized deformation/thermomechanical treatment can introduce favorable combinations of both. The presented study characterizes the correlation of microstructure development and electric properties within copper processed by the severe plastic deformation method of high pressure torsion, the primary advantage of which is that it enables to achieve grains with the sizes in the ultra‐fine, or even nano scales. The study investigates structure development during progressive deformation. In other words, samples processed by single and double high pressure torsion revolutions were evaluated from the viewpoints of grain sizes and grain boundaries, and the results were correlated with the experimentally measured electric conductivity. The single high pressure torsion revolution contributed to grain size decrease, while the structure after double revolution exhibited very fine grains, especially at the sample periphery featuring the highest imposed strain. Both the samples also exhibited increases in microhardness (especially after double revolution), and electric conductivity higher than 100 % IACS. The results confirmed that copper conductors featuring enhanced mechanical properties and favorable electric conductivity can be manufactured by severe plastic deformation. Translation abstract Kupfer mit hohem Reinheitsgrad hat eine ausgezeichnete elektrische Leitfähigkeit, aber im Allgemeinen sehr geringe mechanische Eigenschaften. Durch eine optimierte Verformung/thermomechanische Behandlung können jedoch günstige Kombinationen aus beiden Eigenschaften erzielt werden. In der vorliegenden Studie wird die Korrelation zwischen der Gefügeentwicklung und den elektrischen Eigenschaften von Kupfer untersucht, das unter hoher plastischer Verformung durch Torsion (HPT, high pressure torsion) bearbeitet wurde. Im Rahmen der vorliegenden Studie wird die Strukturentwicklung bei fortschreitender Verformung untersucht. Das heißt, die mit einfachen und doppelten HPT‐Umdrehungen bearbeiteten Proben wurden hinsichtlich der Korngrößen und Korngrenzen bewertet, und die Ergebnisse wurden mit der experimentell gemessenen elektrischen Leitfähigkeit in Korrelation gesetzt. Während die einfache HPT‐Umdrehung zu einer Verringerung der Korngröße beitrug, wies die Struktur nach der doppelten Umdrehung sehr feine Körner auf, insbesondere an der Probenperipher
ISSN:0933-5137
1521-4052
DOI:10.1002/mawe.202400019