Antenna-in-package system integrated with meander line antenna based on LTCC technology

We present an antenna-in-package system integrated with a meander line antenna based on low temperature co-fired ceramic （LTCC） technology. The proposed system employs a meander line patch antenna, a packaging layer, and a laminated multi-chip module （MCM） for integration of integrated circuit （IC）...

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Bibliographic Details
Published in:Frontiers of information technology & electronic engineering 2016, Vol.17 (1), p.67-73
Main Authors: Dong, Gang, Xiong, Wei, Wu, Zhao-yao, Yang, Yin-tang
Format: Article
Language:English
Subjects:
AiP
antenna
AntennaAn-package
ceramic
co-fired
Communications Engineering
Computer Hardware
Computer Science
Computer Systems Organization and Communication Networks
Electrical Engineering
Electromagnetic coupling
Electronics and Microelectronics
Instrumentation
Integrated circuits
line
Low
Low temperature
LTCC
MCM
Meander
module
Multi-chip
Multichip modules
Networks
Patch antennas
temperature
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Description
Summary:We present an antenna-in-package system integrated with a meander line antenna based on low temperature co-fired ceramic （LTCC） technology. The proposed system employs a meander line patch antenna, a packaging layer, and a laminated multi-chip module （MCM） for integration of integrated circuit （IC） bare chips. A microstrip feed line is used to reduce the interaction between patch and package. To decrease electromagnetic coupling, a via hole structure is designed and analyzed. The meander line antenna achieved a bandwidth of 220 MHz with the center frequency at 2.4 GHz, a maximum gain of 2.2 dB, and a radiation efficiency about 90% over its operational frequency. The whole system, with a small size of 20.2 minx6.1 mmx2.6 mm, can be easily realized by a standard LTCC process. This antenna-in-package system integrated with a meander line antenna was fabricated and the experimental results agreed with simulations well.
ISSN:2095-9184
2095-9230
DOI:10.1631/FITEE.1500167