Design and optimization of high flexible motion profile for high acceleration to reduce vibration

With the growing development of surface mounted technology, the precision and efficiency of chips packaging, especially chips placing, have become the focus of attention. The chips placing is a high-velocity and high-dynamic point-to-point motion, and the discontinuous motion is easy to exist vibrat...

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Bibliographic Details
Published in:Journal of the Brazilian Society of Mechanical Sciences and Engineering 2023-12, Vol.45 (12), Article 619
Main Authors: Hu, Guo-qing, Ma, Jian-wei, Wang, Yun-feng, Su, Jia-hao, Zhou, Zi-qi
Format: Article
Language:English
Subjects:
Amplitudes
Design optimization
Engineering
High acceleration
Kinematics
Mechanical Engineering
Motion effects
Optimization
Parameters
Polynomials
Technical Paper
Vibration
Vibration control
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Summary:With the growing development of surface mounted technology, the precision and efficiency of chips packaging, especially chips placing, have become the focus of attention. The chips placing is a high-velocity and high-dynamic point-to-point motion, and the discontinuous motion is easy to exist vibration, seriously affecting the accuracy of the patch. To reduce the vibration during chips placing, the high-flexible motion profile with continuous acceleration is designed based on quintic polynomial under the kinematic constraints. Then, considering the efforts of different motion parameters on operating vibrations, the optimization objective function is constructed to obtain the optimal combination of velocity and acceleration. Finally, the amplitude-frequency characteristics of different motion profiles are analyzed and compared to verify the superiority of the proposed profile and the correctness of the proposed optimization method. The simulation and experimental results show that the motion profile with optimal parameters has lower amplitude of low frequency, which can reduce the vibration amplitude, improving the accuracy of chips placing.
ISSN:1678-5878
1806-3691
DOI:10.1007/s40430-023-04520-3