Microstructured BN Composites with Internally Designed High Thermal Conductivity Paths for 3D Electronic Packaging (Adv. Mater. 38/2022)

Heat Transfer In article number 2205120, Hortense Le Ferrand and co‐workers present a high‐thermal‐conductivity BN‐based composite with locally oriented microstructures that can conduct heat intentionally toward specific areas. The customizable heat‐transfer paths highlight a solution for thermal ma...

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Bibliographic Details
Published in:Advanced materials (Weinheim) 2022-09, Vol.34 (38), p.n/a
Main Authors: He, Hongying, Peng, Weixiang, Liu, Junbo, Chan, Xin Ying, Liu, Shike, Lu, Li, Le Ferrand, Hortense
Format: Article
Language:English
Subjects:
boron nitride composites
directional heat dissipation
Electronic packaging
Heat transfer
high thermal conductivity
Materials science
microstructure design
platelet orientation
Thermal conductivity
Thermal management
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Summary:Heat Transfer In article number 2205120, Hortense Le Ferrand and co‐workers present a high‐thermal‐conductivity BN‐based composite with locally oriented microstructures that can conduct heat intentionally toward specific areas. The customizable heat‐transfer paths highlight a solution for thermal management of future 3D integrated electronics.
ISSN:0935-9648
1521-4095
DOI:10.1002/adma.202270266