Heat transfer intensification in microchannel by induced-charge electrokinetic phenomenon: a numerical study

In this numerical investigation, the induced-charge electrokinetic phenomenon is used to intensify the convective heat transfer rate in the microchannel. The electrically conductive obstacles are placed in the microchannel for inducing the vortices and subsequently, enhancing the mixing of fluid and...

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Bibliographic Details
Published in:	Journal of thermal analysis and calorimetry 2021-08, Vol.145 (4), p.1849-1861
Main Authors:	Najjaran, Soroush, Rashidi, Saman, Valipour, Mohammad Sadegh
Format:	Article
Language:	eng
Subjects:	Analytical Chemistry Barriers Chemistry Chemistry and Materials Science Computational fluid dynamics Convective heat transfer Electric field strength Electric fields Electric properties Electrokinetics Heat transfer Heat transfer coefficients Inorganic Chemistry Measurement Science and Instrumentation Microchannels Numerical analysis Physical Chemistry Polymer Sciences
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Summary:	In this numerical investigation, the induced-charge electrokinetic phenomenon is used to intensify the convective heat transfer rate in the microchannel. The electrically conductive obstacles are placed in the microchannel for inducing the vortices and subsequently, enhancing the mixing of fluid and convective heat transfer rate. The results gained by the current numerical simulation are benchmarked with the other data available in the literature to ensure about the precision of the numerical solver. The influences of several parameters, including the length, location, and number of conductive obstacles and the electric field intensity, on the convective heat transfer rate are studied. The outcomes indicate that the convective heat transfer coefficient achieved for the case of the microchannel equipped with the electrically conductive obstacle is about 18 times larger as compared with the case of the empty microchannel without placing the electrically conductive obstacle. It is suggested to install the conductive obstacle near the inlet of the microchannel to achieve a higher heat transfer rate. The convective heat transfer coefficient increases up to 215.4% inside the microchannel as length of the conductive obstacle is increased from 15 to 35 µm. Finally, the normalized convective heat transfer coefficient improves about 743.4% when the electric field strength is boosted from 20 to 60 V cm −1 .
ISSN:	1388-6150 1588-2926