High-Performance On-Chip Hot-Pressed NdFeB Hard Magnets for MEMS Applications

In order to advance the potential of thick on-chip hard magnets for the micro-electro-mechanical system (MEMS), we investigate a new silicon molding technique to fabricate dry-packed NdFeB magnets, including a silicon compression tool, which enables the pressing step during silicon-compatible proces...

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Bibliographic Details
Published in:IEEE transactions on magnetics 2021-04, Vol.57 (4), p.1-4
Main Authors: He, Yifan, Yu, Chengju, Haidar, Samer, Zaeimbashi, Mohsen, Stephen, Gregory M., Heiman, Don, Wei, Yuyi, Chen, Huaihao, Liang, Xianfeng, Dong, Cunzheng, Wang, Jiawei, Tu, Cheng, Zhang, Yi, Chen, Baoxing, Sun, Nian-Xiang
Format: Article
Language:English
Subjects:
Bonded magnet
hot-pressing
Magnetic domains
Magnetic flux
Magnetic resonance imaging
Magnetism
Magnetometers
Microelectromechanical systems
neodymium iron boron (NdFeB)
permanent magnet
Permanent magnets
Powders
Pressure molding
Remanence
Silicon
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Summary:In order to advance the potential of thick on-chip hard magnets for the micro-electro-mechanical system (MEMS), we investigate a new silicon molding technique to fabricate dry-packed NdFeB magnets, including a silicon compression tool, which enables the pressing step during silicon-compatible processing. This process delivers samples with a remanence of 0.42 T and an energy product of 38 kJ/m 3 . Further studies of metal molding show that, for wax-bonding powder-based NdFeB magnets, the optimum fabrication condition is 300 °C and 425 MPa, giving a remanence of 0.54 T and an energy product of 61.7 kJ/m 3 .
ISSN:0018-9464
1941-0069
DOI:10.1109/TMAG.2021.3057271