Solvent‐resistant ultrafine nonwoven fibrous membranes by ultraviolet‐assisted electrospinning of organo‐soluble photosensitive polyimide resin

An ultraviolet‐assisted electrospinning (UVAES) method was investigated to improve the solvent stability of soluble polyimide (PI) electrospun ultrafine fibrous membranes (UFMs) to assist in the development of fibrous polymeric materials with improved resistance to harsh environmental conditions and...

Full description

Saved in:
Bibliographic Details
Published in:Journal of applied polymer science 2021-03, Vol.138 (12), p.n/a
Main Authors: Qi, Lin, Liu, Jin‐gang, Yang, Yang, Guo, Chen‐yu, Huangfu, Meng‐ge, Zhang, Yan
Format: Article
Language:English
Subjects:
Corrosion resistance
Crosslinking
Dianhydrides
Dimethyl acetamide
Electrospinning
fibers
Filaments
Materials science
Membranes
Optical properties
photopolymerization
Photosensitivity
Polyimide resins
Polymers
Solvents
Spinning (materials)
thermal properties
Thermal resistance
Thermal stability
Ultrafines
Wearable technology
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:An ultraviolet‐assisted electrospinning (UVAES) method was investigated to improve the solvent stability of soluble polyimide (PI) electrospun ultrafine fibrous membranes (UFMs) to assist in the development of fibrous polymeric materials with improved resistance to harsh environmental conditions and to expand the potential applications for such soft filaments. A preimidized soluble negative photosensitive polyimide (PSPI) was synthesized via an one‐step thermal polycondensation from 3,3′,4,4′‐benzophenonetetracarboxylic dianhydride (BTDA) and 1,1′‐bis(4‐amino‐3,5‐dimethylphenyl)‐1‐(3′‐trifluoromethylphenyl)methane (TFMDA). The PI resin was then fabricated into UFMs by both conventional electrospinning (ES) and UVAES with N,N‐dimethylacetamide (DMAc) as the solvent. During spinning, photo crosslinking reaction occurred, accompanied by simultaneous micro‐jets of PI‐UV ultrafine fibers in the UVAES procedure. This created fibers that were thermally stable at higher than 500°C, reflection over 77% of the 457‐nm‐ wavelength light, whiteness index (WI) higher than 83, and enhanced solvent resistance in DMAc. Generally speaking, compared with the PI UFMs fabricated by conventional ES procedure, the PI‐UV UFMs obtained by the newly‐developed UVAES procedure showed much superior solvent resistance, comparable thermal stability, slightly decreased optical reflectance and WI values, and reduced fiber diameters. These properties are of great value to future applications in microelectronics and wearable technology. The solvent resistance of the directly electrospun PI ultrafine fibrous membranes is tremendously improved by the combination of in‐situ photoinduced crosslinking with electrospinning methods. The ultrafine fibers are thermally stable at higher than 500°C and enhanced solvent resistance against organic solvent DMAc, which is of great value in applications under harsh conditions.
ISSN:0021-8995
1097-4628
DOI:10.1002/app.50048